1 | Conference poster | FDC Application in CVD area: real time gas flow monitor | S. Pampuri, A. Schirru, M. Galbiati, G. Fazio, G. De Nicolao | Numonyx, UNiPV | WP3 | 10th European Advanced Equipment Control/ Advanced Process Control Conference, Catania, Sicily - Italy |
2 | Conference poster | Virtual Metrology algorithm for semiconductor manufacturing | S. Pampuri, A. Schirru, C. Bevilacqua, G. Fazio, G. De Nicolao | Numonyx, UNiPV | WP2 | 10th European Advanced Equipment Control/ Advanced Process Control Conference, Catania, Sicily - Italy |
3 | Conference poster | Monotone signal filtering and prediction with application in dry etch predictive maintenance | S. Pampuri, A. Schirru, C. Bevilacqua, G. Fazio, G. De Nicolao | Numonyx, UNiPV | WP3 | 10th European Advanced Equipment Control/ Advanced Process Control Conference, Catania, Sicily - Italy |
4 | Conference poster | A Multilevel Model based technique for Fault Detection in Dry Etch Chamber Matching | S. Pampuri, A. Schirru, C. Bevilacqua, G. Fazio, G. De Nicolao | Numonyx, UNiPV | WP3 | 10th European Advanced Equipment Control/ Advanced Process Control Conference, Catania, Sicily - Italy |
5 | Conference presentation | Role of the atomic scale simulations in the virtual metrology of plasma processes | A. La Magna, L. Chiaramonte, G.Garozzo, R. Colombo, G. Fazio | Numonyx, CNR IMM | WP2 | 10th European Advanced Equipment Control/ Advanced Process Control Conference, Catania, Sicily - Italy |
6 | Conference presentation | Evaluation of economic effects as the basis for assessing the investment into Virtual Metrology | M. Koitzsch, A. Honold | IISB, InReCon | WP1 | ISMI Manufacturing Week AEC/APC Symposium, Austin - USA |
7 | Conference presentation | ‘Virtual Metrology’ on Plasma Tools – Test Cases and End User Perspectives | Mick Tiernan, Niall Mac Gearailt, Ger Ennis, Karl Brennan. | Intel | WP2 | ARCSIS2010 13th Technical + Scientific Meeting on ' Manufacturing Challenges in European Semiconductor Fabs). |
8 | Conference presentation | Metrology Models for Predicting CVD Oxide Thickness of a PECVD Process | D. Gleispach, J, Besnard, A. Ferreira, A. Roussy, C. Kernaflen, H. Gris, G. Hayderer | austriamicrosystems, EMSE-CMP, PDF Solutions | WP2 | 10th European Advanced Equipment Control/ Advanced Process Control Conference, Catania, Sicily - Italy |
9 | Conference presentation | Scheduling of Foreline Maintenance on a CVD Tool Based on FDC Parameter | G. Hayderer, M. Radl, P. Scheibelhofer, E. Stadlober, H. Purwins, T.Purwins, D. Gleispach | austriamicrosystems, EMSE-CMP, PDF Solutions | WP3 | 10th European Advanced Equipment Control/ Advanced Process Control Conference, Catania, Sicily - Italy |
10 | Conference presentation | Virtual Metrology Models for Predicting Average PECVD Oxide Film Thickness | A. Ferreira, D. Gleispach, A. Roussy, H. Gris, G. Hayderer, C. Kernaflen and J. Besnard | austriamicrosystems, EMSE-CMP, PDF Solutions | WP2 | 22nd IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC), New York, USA, May 2011 |
11 | Conference poster | Architecture for the Integration of Virtual Metrology and Predictive Maintenance into Existing Fab Systems. | G. Roeder, M. Schellenberger, M. Pfeffer, A. Kyek, A. Knapp, H. Mühlberger. | Fraunhofer IISB, Infineon Technologies - Regensburg, University of Augsburg. | WP1 | 10th European Advanced Equipment Control/ Advanced Process Control Conference, 2010, Catania, Italy. |
12 | Conference presentation | A Smart Sampling Algorithm to Minimize Risk Dynamically | S. Dauzère-Pérès, JL. Rouveyrol, C. Yugma, P. Vialletelle | ST-Microelectronics, EMSE-CMP | WP4 | ASMC 2010, San Francisco
21st Advanced Semiconductor Manufacturing Conference |
13 | Article for Poster | Predictive Maintenance supported by Advanced Process Control (APC) opens new equipment engineering and manufacturing opportunities | Stéphane Hubac 2 Frederic Duvivier 3Eric Zamai, 1,4 Aymen Mili | ST-Microelectronics, GSCOP,EMSE-CMP | WP3 | ASMC 2010, San Francisco
21st Advanced Semiconductor Manufacturing Conference |
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15 | Conference presentation | A novel approach to minimize the number of controls in Defectivity area | J. Nduhura, C. Yugma, S. Dauzère‐Pérès, P. Vialletelle | EMSE-CMP, ST-Microelectronics | WP4 | ARCSIS2010 13th Technical + Scientific Meeting on ' Manufacturing Challenges in European Semiconductor Fabs). |
16 | Conference presentation | An approach for operational risk evaluation and its link to control plan | B. Bettayeb, P. Vialletelle, S. Bassetto, M. Tollenaere | G-SCOP, STMicroelectronics | WP4 | ARCSIS2010 13th Technical + Scientific Meeting on ' Manufacturing Challenges in European Semiconductor Fabs). |
17 | Conference presentation | Computation of Wafer-At-Risk from Theory to Real Life Demonstration | M.Sahnoun, P. Vialletelle, S. Bassetto, S. Bastoini, M. Tollenaere | G-SCOP, STMicroelectronics | WP4 | ARCSIS2010 13th Technical + Scientific Meeting on ' Manufacturing Challenges in European Semiconductor Fabs). |
18 | Conference presentation | Optimized design of control plans based on risk exposure and resources capabilities | B. Bettayeb, P. Vialletelle, S. Bassetto, M. Tollenaere | G-SCOP, STMicroelectronics | WP4 | ISSM2010, Tokyo
18th International Symposium on Semiconductor Manufacturing |
19 | Conference presentation | Optimizing Return On Inspection Trough Defectivity Smart Sampling | M.Sahnoun, P. Vialletelle, S. Bassetto, S. Bastoini, M. Tollenaere | G-SCOP, STMicroelectronics | WP4 | ISSM2010, Tokyo
18th International Symposium on Semiconductor Manufacturing |
20 | Article | Toward exposure based control plan for semiconductor industries | Belgacem Bettayeb, MSc; Samuel Bassetto; Michel Tollenaere, PhD; Philippe
Vialletelle | G-SCOP, STMicroelectronics | WP4 | International Journal of Production Economics |
21 | Conference Poster | Estimating CVD Thickness through Statistical InferenceMethods | Gian Antonio Susto, Alessandro Beghi, Cristina De Luca | University of Padova, Infineon Austria | WP2 | Intel European and Research Conference Ireland 2010 |
22 | Conference Poster | A Predictive Maintenance System for Epitaxy Process | Gian Antonio Susto, Alessandro Beghi, Cristina De Luca, Michael Holzinger, Martin Huber | University of Padova, Infineon Austria | WP3 | Intel European and Research Conference Ireland 2010 |
23 | Conference presentation | ‘Virtual Metrology’ on Plasma Tools – Test Cases and End User Perspectives | Mick Tiernan, Niall Mac Gearailt, Ger Ennis, Karl Brennan. | Intel | WP2 | ARCSIS2010 13th Technical + Scientific Meeting on ' Manufacturing Challenges in European Semiconductor Fabs). |
24 | Conference presentation | Dynamic Management of Controls in Semiconductor
Manufacturing | Justin Nduhura Munga, Stéphane Dauzère-Pérès, Philippe Vialletelle, Claude Yugma | EMSE-CMP, ST-Microelectronics | WP4 | 22nd IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC), New York, USA, May 2011 |
25 | Conference presentation | A Predictive Maintenance System for Silicon Epitaxial Deposition | Gian Antonio Susto, Alessandro Beghi, Cristina De Luca | University of Padova, Infineon Austria | WP3 | 7th IEEE Conference on Automation Science and Engineering (CASE), Trieste, 24-27 August 2011 |
26 | Conference presentation | A Virtual Metrology System for Predicting CVD Thickness with Equipment Variables and Qualitative Clustering | Gian Antonio Susto, Alessandro Beghi, Cristina De Luca | University of Padova, Infineon Austria | WP2 | 16th IEEE International Conference on Emerging Technologies and Factory Automation (EFTA), Toulouse, 5-9 September 2011 |
27 | Article | Evaluation of Economic Effects as the Basis for Assessing Virtual Metrology Investment | M. Koitzsch, A. Honold | Fraunhofer IISB, InReCon | WP1 | Future Fab International |
28 | Conference presentation | A Statistical Approach for Maintenance Management in Semiconductor Manufacturing | Gian Antonio Susto, Alessandro Beghi, Cristina De Luca | University of Padova, Infineon Austria | WP3 | Statistical Methods Applied in Microelectronics, Milan, 13 June 2011 |
29 | Conference Poster | Correlation Analysis of WAT Data to FDC Data from a CVD Tool | A. Proßegger, F. Fratte, D. Gleispach and G. Hayderer | austriamicrosystems | WP3 | 11th European Advanced Equipment Control/ Advanced Process Control Conference, Dresden, Germany |
30 | Conference Poster | Stochastic Gradient Boosting Methodology for Virtual Metrology on a PVD Tool | D. Gleispach, P. Scheibelhofer and G. Hayderer | austriamicrosystems | WP2 | 11th European Advanced Equipment Control/ Advanced Process Control Conference, Dresden, Germany |
31 | Conference Poster | Random Tree Ensembles for Predictive Maintenance of Filament Breakdown on an Implanter | P. Scheibelhofer, M. Berger, P. Schröttner, D. Gleispach and G. Hayderer | austriamicrosystems | WP3 | 11th European Advanced Equipment Control/ Advanced Process Control Conference, Dresden, Germany |
32 | Conference Poster | Developing a Predictive Maintenance Model to Minimize Helium Backside Cooling Faults on a AMAT Centura Dry Etch Tool | S. Schindler, S. Monot, F. Duvivier | austriamicrosystems, Probayes | WP3 | 11th European Advanced Equipment Control/ Advanced Process Control Conference, Dresden, Germany |
33 | Article | Virtual Metrology Models for Predicting Average PECVD Oxide Film Thickness | A. Ferreira, A. Roussy, C. Kernaflen, D. Gleispach, G. Hayderer, H. Gris, J. Besnard | EMSE-CMP, austriamicrosystems, PDF Solutions | WP2 | ASMC 2011, Saratoga Springs
22st Advanced Semiconductor Manufacturing Conference |
34 | Conference Presentation | Comparison of Bayesian Networks and Tree Ensembles for Prediction of Implanter Filament Breakdown | P. Scheibelhofer, U. Schöpka, G-Leditzky | austriamicrosystems, Fraunhofer IISB | WP3 | Statistical Workshop Milan, 2011 |
35 | Conference Presentation | Regression Methods for Prediction of PECVD Silicon Nitride Layer Thickness | H. Purwins, A. Nagi, B. Barak, U. Höckele, A. Kyek, B. Lenz, G. Pfeifer, K. Weinzierl | Infineon Technologies - Regensburg, PMC | WP2 | 7th IEEE Conference on Automation Science and Engineering (CASE), Trieste, 24-27 August 2011 |
36 | Article | Dependability of complex semiconductor systems | M. F. Bouaziz, E. Zamaï, F Duvivier, S. Hubac | G-SCOP, Probayes, STMicroelectronics | WP3 | 3rd International Workshop on Dependable Control of Discrete Systems (IEEE DCDS 2011), paper N°41, pp 09–14, Saarbrüken, Germany, june 15-17 2011 |
37 | Article | Towards Bayesian Network methodology to improve maintenance of semiconductor systems | M. F. Bouaziz, E. Zamaï, S. Monot, F. Duvivier, S. Hubac | G-SCOP, Probayes, STMicroelectronics | WP3 | Proceedings of European Safety & Reliability Conference (ESREL 2011), Bérenguer, Grall & Guedes Soares (eds) © 2012 Taylor & Francis Group, London, UK. ISBN 978-0-203-13510-5, pp 116 – 123, Troyes, France, september 18-22 2011 |
38 | Conference Poster | Sûreté de fonctionnement des équipements
de fabrication semi-conducteurs
Approche par réseaux Bayésiens | M. F. Bouaziz, E. Zamaï, S. Monot, F. Duvivier, S. Hubac | G-SCOP, Probayes, STMicroelectronics | WP3 | 4ème Workshop du Groupement d'Intérêt Scientifique «Surveillance, Sûreté et Sécurité des Grands Systèmes » (3SGS'11), poster N°25, Valenciennes, France, 12-13 Octobre, 2011. |
39 | Regular Paper | Virtual Metrology for PECVD Silicon Nitride Layer Thickness with Support Vector Regression | H. Purwins, A. Nagi, B. Barak, R. Engel,
U. Höckele, A. Kyek, S. Cherla, B. Lenz,
G. Pfeifer, K. Weinzierl | Infineon Technologies AG, PMC | WP2 | IEEE/ASME Transactions on Mechatronics |
40 | Regular Paper | A Novel Method for Monitoring Fluid Suspensions: Current Results and Perspectives | M.A.C. Potenza, T. Sanvito, A. Pullia, M. Giglio, D.Di Cola, D. Lavalle | UNIMI, TF | WP3 | Future Fab International, Issue 39 |
41 | Regular Paper | Developing a Framework
for Virtual Metrology and
Predictive Maintenance | M. Schellenberger, G. Roeder, A. Mattes,
M. Pfeffer, L. Pfitzner, A. Knapp, H. Mühlberger, J. Bichlmeier, C. Valeanu,
A. Kyek, B. Lenz, M. Frisch, G. Leditzky | Fraunhofer IISB, University of Augsburg, Camline GmbH, Infineon Technologies AG, austriamicrosystems | WP5 | Future Fab International, Issue 39 |
42 | Regular Paper | A Mathematical Programming Approach for
Determining Control Plans in Semiconductor
Manufacturing | Justin Nduhura Munga, Stéphane Dauzère-Pérès, Claude Yugma, Philippe Vialletelle | EMSE-CMP, ST-Microelectronics | WP4 | IESM 2011 - International Conference on Industrial Engineering and Systems Management, May 25 - 27, 2011
Metz- France |
43 | Workshop Poster | Equipment Health Factor calculation for equipment diagnosis and maintenance optimization in complex semiconductor workshops | M-F. Bouaziz, Q-B. Duong, E. Zamaï, S. Hubac, F. Duvivier | G-SCOP, ST-Microelectronics, Probayes | WP3 | Workshop: Applications industrielles « Sûreté, Surveillance, Supervision » (GTS3-GDRMACS/SEE/SAFFE-GIS3SGS), poster N°29, Paris, France, 18 Janvier, 2012. |
44 | Regular Paper | Impact of Control Plan Design on Tool Risk Management: A Simulation Study in Semiconductor Manufacturing | G.L. Rodriguez Verjan, S. Dauzère-Pérès, J. Pinaton | EMSE-CMP, ST-Microelectronics | WP4 | Proceedings of the 2011 Winter Simulation Conference |
45 | Article | Quality and exposure control in semiconductor manufacturing. Part II: Evaluation | Belgacem Bettayeb, MSc; Samuel Bassetto; Michel Tollenaere, PhD; Philippe
Vialletelle | G-SCOP, STMicroelectronics | WP4 | International Journal of Production Research, December 2011 |
